Rationale
Industry moves towards ever increasing functionality, performance, miniaturization and less cost, resulting in higher heat densities and corresponding higher temperatures. Unfortunately, these have a negative impact on the performance, reliability and lifetime of electronic products, making thermal design more challenging than ever.
Optimization of thermal design is relevant for many electronic applications, such as consumer electronics, semiconductors, power electronics, LED applications, automotive, data centers, internet of everything, digital twins etc.
The very experienced lecturer Wendy Luiten (winner of the prestigious Harvey Rosten Award 2014 and the Thermi Award 2024) teaches participants how to solve the thermal problems inherent in electronics today. Based on lots of industrial thermal design experience, she presents a balanced mix of theory and practice.
The famous 20+year old 3-day classroom course, originally intended for inexperienced as well as experienced participants, has been replaced by two modules to meet the requirements of modern times.
This module is organized either as a 5 half-days online module (via Microsoft Teams) or as a 3 full-days offline classical course. It is intended for engineers not experienced in thermal design.
This module is organized as a 3 half-days online module (via Microsoft Teams). It is intended for engineers familiar with at least the contents of the thermal design module.
We kept the excellent and high-quality contents. We addressed feedback from our previous trainings to change the original course:
The thermal design module allows for sufficient opportunities for practicing and achieving an active skill level for designing new thermal applications, evaluating existing thermal applications, and assessing computational simulation models.
The advanced part builds on this foundation and is scheduled several weeks later. This provides more time to get familiar with the material and facilitates the uptake of the advanced material.
We strongly advice not to attend only the thermal design part since the advanced thermal management course gives very valuable additional information to assist in preventing thermal problems.
Both trainings are available for open enrollment as well as for in-company sessions. For in-company sessions, the training can be adapted to your situation and special needs.
After the course, the participant:
This course is intended for engineers (electronic, mechanical/mechatronic, reliability) directly involved with thermal design and cooling of electronic components, modules and systems, engineers confronted with thermal problems/issues, Thermal Engineers, System Architects, or those who want to understand and learn more about this subject of growing importance due to the electronification of society, be it automotive, LEDs, Internet-of-Things or data centers.
Prerequisites: technical college/university education.
For the module Advanced Thermal Management of Electronics, it is required that the module Electronics Cooling Thermal Design has been attended or an equivalent level of background knowledge is present.
The course is scheduled for 3 half days of online training.
• A recap of the ‘Electronics Cooling Thermal Design’ training followed by a small case to practice the basics;
• Advanced heat transfer (conduction, convection, radiation, periodic boundary conditions);
• Advanced fan Cooling (fan noise, fan control);
• Liquid cooling;
• Numerical simulations: Validation, introduction to Optimization and Robust design;
• Cooling solutions for high power;
• A case to practice the discussed advanced topics (as a heatsink in forced liquid cooling).
In-depth lectures and two hands-on cases from industry are included as guided team exercises.
Course material: 200+ page theory reader containing a copy of the slides.
The booklet Heat Transfer Theory applied to Electronics Cooling by Lasance & Luiten.
A copy of relevant papers on the topics is available on request.
Participants will receive a High Tech Institute course certificate for attending this workshop.
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